AI assistance only. Final quality disposition requires human verification. Hidden solder joints (BGA/QFN voids, head-in-pillow) require X-ray inspection.
AOI-Lite Batam: AI-Assisted SMT Inspection

Batam Electronics Manufacturing & SMK Lab Quality Assistant

Visual PCB Inspection Station

Inspector: Siti · Line 1|Station: Line 1 · Post-Reflow Station|Board: BAT-SMT-201 (Rev A)
Review timer:0s
Step 1 · Select or Capture Board

Pick a sample board, upload a photo, or use the bench camera

Step 2 · Review AI Findings

Check highlighted issues and confirm or adjust each finding

Step 3 · Final Sign-Off

Confirm Pass, Rework, Quarantine, or Escalate to save the record

Board Image Input

Choose or capture a PCB to inspect

Board: BAT-SMT-201
Filter board type:
Ready for Inspection

Click “Run AI Visual Check” to inspect this board

The AI assistant scans the board photo for visible component and solder issues, explains what it sees in plain language, and prepares a quality record for your sign-off.

What the AI Visual Check looks for (6 visible defect types):

Missing Component

Empty solder pad where a component should be mounted

Solder Bridge / Short

Unintended solder or copper joining adjacent pads or pins

Wrong Polarity / Orientation

Diode, capacitor, or IC mounted in reverse orientation

Tombstoning (Lifted Chip)

Small chip component lifted vertically off one pad

Misaligned / Shifted Component

Component skewed, rotated, or shifted off its solder pads

Surface / Copper Trace Anomaly

Open copper trace, pinhole, copper spur, or ambiguous surface mark